Robert Crimmins

nVent · Full-time

New York City Metropolitan Area · Remote

• Technical Lead for nVent’s HVDC portfolio, driving integration and testing of emerging 800 VDC and ±400 VDC AI-factory power architectures, including HVDC power shelves and PSUs, touch-safety and grounding, and sidecar-to-rack interfaces feeding GPU compute; engage NVIDIA and AMD on their evolving power designs
• Evaluate facility-to-rack power architectures spanning AC overhead busway (tap boxes and cable whips); high-power LVDC rectification; emerging 800 VDC and ±400 VDC distribution and DC bus; HVDC distribution-panel-to-rack cabling; solid-state transformers (rack and facility level); and rack-, row-, and facility-scale battery energy storage (e.g., Tesla Megapack)
• Contributed power-distribution and liquid-cooling content to the Siemens × nVent 100 MW Hyperscale AI Blueprint - a Tier III reference architecture for NVIDIA GB200 NVL72 (127 kW/rack) AI factories
• Own the electrical architecture and full product lifecycle of nVent’s intelligent rack-level AC and DC power-distribution portfolio - horizontal/vertical AC PDUs and low-voltage DC iPDUs with input and output metering and switching - integrated across the utility-to-chip power path
• Architected nVent’s first switched and metered DC iPDU (Smart DCDU) for an international telecom partner in Finland - captured requirements on-site, delivered the first prototype in 87 days, and supported multimillion-dollar revenue
• Modeled and tested transient behavior, protection, and soft-start across AC and DC power products, using regenerative test equipment to reproduce characterized AI-workload power pulses
• Owned DCDU product compliance end-to-end - mapped the applicable safety and EMC standards and led UL/IEC/CSA/ETL safety and EMI/EMC qualification on-site at Intertek (Lake Forest, CA)
• Designed and built an AI-assisted liquid-cooling configurator (routing, fitment, and BOM) across nVent’s modular TCS catalog - enabling rapid quoting, shipping, and deployment of liquid-cooled systems
• One of nVent’s AI leaders driving AI-tool adoption across the company: running engineering workshops and continuously benchmarking and qualifying frontier models (cost vs. capability) for the software organization
• Conduct on-site facility site-walks and provide commissioning support for PDU, CDU, and liquid-cooling (TCS) deployments - assessing power, cooling, and layout, and partnering with key accounts through integration, bring-up, and lifecycle management
• Lead trade-show reconnaissance and competitive intelligence (OCP, GTC, SC, DCD, DCW) - surveying mechanical, electrical, software, and system-architecture designs on the show floor, then reporting the competitive landscape and helping steer the SmartPower and Liquid Cooling roadmap with executive leadership
• Led an NPI-standardization Kaizen with company leadership - instituting formal phase-gate reviews and a RACI ownership model across global EE/ME/SW/MFG teams

Argo AI · Full-time

Princeton, NJ · On-site

• Drove end-to-end development of Argo Lidar, a purpose-built Geiger-mode LiDAR platform for autonomous vehicles
• Designed hardware and software to bring up, calibrate, test, and debug vehicle sensors
• Triaged and resolved issues with current and legacy sensors on autonomous vehicles using root cause analysis
• Scaled prototype designs to volume production with global contract manufacturers and suppliers
• Worked cross-functionally between engineering teams, TPMs, customers, OEM partners, CMs, and suppliers

Raytheon Technologies (Sensors Unlimited) · Full-time

Princeton, NJ · On-site

• Designed time-of-flight, low-power, small-form-factor shortwave-infrared (SWIR) sensors and camera systems
• Streamlined performance and reliability testing by automating data ingest, parsing, and trend plotting
• Unified a modular and scalable HW/SW/FW solution to ensure proper assembly of products at suppliers
• Tested and validated camera systems to ensure compliance with customer interface control documents (ICDs)
• Developed electrical equipment for evaluating and characterizing readout integrated circuits (ROICs)

Tesla · Internship

San Francisco Bay Area · On-site

• Integrated a ground-up 48 V decentralized power-distribution and communication architecture for Cybertruck
• Built a full-scale operational prototype vehicle and converted the Model 3/Y device platform for Cybertruck compatibility
• Presented platform, roadmap, resource allocation, and production methods to executive leadership; implemented significant platform cost reductions
• Developed the Wiring System Architecture later patented by Tesla - Application #16231314, Publication #20190217794

SpaceX · Internship

Los Angeles, CA · On-site

• Developed and integrated improved Falcon 9 and Falcon Heavy avionics hardware architecture
• Built and tested hardware-in-the-loop test racks to validate flight hardware via simulation
• Created a payload-separation simulator to qualify flight-computer electrical-signal performance
• Designed NI PXIe data-acquisition PCBAs across the production floor for vehicle sensor testing
• Deployed onshore and offshore landing pad hardware for post-mission vehicle operations